发明名称 |
ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE |
摘要 |
An abrasive which comprises a liquid medium, abrasive grains including a hydroxide of a tetravalent metallic element, a first additive, a second additive, and a third additive, wherein the first additive is at least one type selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer, the second additive is a cationic polymer, and the third additive is an amino group-containing sulfonic acid compound. |
申请公布号 |
WO2015098197(A1) |
申请公布日期 |
2015.07.02 |
申请号 |
WO2014JP73980 |
申请日期 |
2014.09.10 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MINAMI HISATAKA;IWANO TOMOHIRO;AKUTSU TOSHIAKI |
分类号 |
C09K3/14;B24B37/00;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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