DISPENSER FOR COATING SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

The present invention relates to a dispenser for coating a semiconductor package and a method for manufacturing the semiconductor package using the same. The dispenser for coating the semiconductor package for coating the whole mounting part including a semiconductor device mounted on a substrate and a wire which electrically connects the substrate and the semiconductor device according to one embodiment of the present invention includes a body part which stores a coating member and an outlet which discharges the coating member and is formed on one side of the body part. The cross section of the outlet has a dome shape with an upper side which is upwardly convex and a lower side which is downwardly spread in both side directions.