PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

Disclosed are a package substrate and a method for manufacturing the same. The method for manufacturing the package substrate according to an embodiment of the present invention includes: a step of forming a first open hole corresponding to a shape of a bonding pad in a first photoresist; a step of stacking a second photoresist on the first photoresist and forming a second open hole corresponding to the shapes of a soldering pad, a circuit pattern layer, and the bonding pad in the second photoresist; and a step of forming pattern plating layers up to a certain height in the first open hole and the second open hole.