| 摘要 |
<p>The present invention relates to a build-up insulating film, a printed circuit board comprising embedded electronic component using the same and a method for manufacturing the same. A build-up insulating film according to an embodiment of the present invention includes a build-up film layer and an adhesive layer formed on a side of the build-up film layer. The adhesive layer includes at least one selected among epoxy, silicon, polyimide, urethane, and ceramic.</p> |
