THERMOSETTING RESIN COMPOSITION AND USE THEREOF

摘要

The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.

主权项

1. A thermosetting resin composition comprising of:
(A) cyanate ester compound and/or cyanate ester prepolymer; (B) polyphosphonate ester and/or phosphonate-carbonate copolymer.