| 发明名称 |
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF |
| 摘要 |
A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion. |
| 申请公布号 |
US2015189742(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414519636 |
申请日期 |
2014.10.21 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
TANABE Hiroyuki |
| 分类号 |
H05K1/02;H05K3/16;H05K3/18;H05K3/14 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A suspension board with circuit comprising:
a metal supporting layer and an insulating layer formed on the metal supporting layer, wherein the insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion. |
| 地址 |
Osaka JP |
