| 摘要 |
The invention relates to a diffusion soldering method in which an electronic component (13) is placed on a substrate (12). The joining surfaces are designed such that cavities (20, 27) are formed in the region of the joining gap (21). The formation of said cavities can be ensured for example by providing depressions in the mounting surface (18) of the component (13) and/or in the contact surface (14) of the substrate (12), the depressions (27) being cup-shaped or advantageously being in the form of channels (20) that surround columnar structural elements (22), the end faces of said structural elements (22) forming the mounting surface (18) or the contact surface (14) for the connection. The cavities (20, 27) are advantageous in that solder material (19) can leak into the cavities when the component (13) is placed on the contact surface (14) of the substrate (12) in order to achieve the required width of the joining gap (21). Thus, the joining gap (21) can be selected so as to have a width so narrow that the joining gap is formed with a diffusion zone (24) which bridges the joining gap (21) upon soldering. In this manner, a diffusion solder connection is produced in an advantageous manner even when using standard solder. The invention further relates to an electronic assembly (11) which has been produced in the aforementioned manner. |
