发明名称 THICKNESS/TEMPERATURE MEASURING APPARATUS, THICKNESS/TEMPERATURE MEASURING METHOD AND SUBSTRATE PROCESSING SYSTEM
摘要 <p>PROBLEM TO BE SOLVED: To measure thickness of a ceramics member disposed within a processing chamber in a desired opportunity.SOLUTION: A thickness/temperature measuring apparatus 50 configured to measure thickness of a ceramics member 35 disposed within a chamber 11 held in a vacuum atmosphere includes: a terahertz wave generation unit 51 that outputs a terahertz wave; a terahertz wave analysis unit 53 that analyzes the inputted terahertz wave; and an optical system including a half mirror 52 for guiding the terahertz wave outputted from the terahertz wave generation unit 51 to the ceramics member 35 and guiding a reflection wave from the ceramics member 35 to the terahertz wave analysis unit 53. The terahertz wave analysis unit 53 performs Fourier transformation on a reflection wave spectrum from the ceramics member 35, thereby calculating an optical path difference between a reflection wave from a front side of the ceramics member 35 and a reflection wave from a rear side, and thickness (d) of the ceramics member 35 is calculated from the calculated optical path difference.</p>
申请公布号 JP2015122354(A) 申请公布日期 2015.07.02
申请号 JP20130263997 申请日期 2013.12.20
申请人 TOKYO ELECTRON LTD 发明人 MATSUDO TATSUO;KOSHIMIZU CHISHIO
分类号 H01L21/3065;G01B11/06 主分类号 H01L21/3065
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