| 发明名称 |
Soldered Components for Downhole Use |
| 摘要 |
The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin. |
| 申请公布号 |
US2015184467(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201514656198 |
申请日期 |
2015.03.12 |
| 申请人 |
SCHLUMBERGER TECHNOLOGY CORPORATION |
发明人 |
Patel Chandradip Pravinbhai;Kostinovsky Mark Alex;Dupouy Francis;Schilling Glen Dell;Iafrate Gilles;McCluskey F. Patrick |
| 分类号 |
E21B17/02;B23K1/20;B23K1/00 |
主分类号 |
E21B17/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of soldering a first component to a second component, the first component comprising an electrically conductive contact region finished with a metallic finish layer, the method comprising:
applying a layer of manganese to the finish layer; and applying solder to the layer of manganese, wherein the solder comprises copper, silver and tin. |
| 地址 |
Sugar Land TX US |
