| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo- and thermo-setting resin composition that can give a cured film excellent in both flexibility and thermal shock resistance without decreasing such characteristics as solder heat resistance, thermal degradation resistance, and acid resistance, and to provide a printed wiring board having a solder resist film (cured film) formed by using the above composition.SOLUTION: An alkali-developable photo- and thermo-setting resin composition comprises a glycoluril compound represented by chemical formula (I), a photosensitive prepolymer having two or more unsaturated double bonds in one molecule, and a photopolymerization initiator. In the formula, Rto Rare same or different from one another, and each represents a hydrogen atom or a glycidyl group. |
