| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
There are provided a semiconductor package and a method for manufacturing the same. The semiconductor package according to an exemplary embodiment of the present disclosure includes: a board on which an insulating layer and a plurality of circuit patterns are formed; first bonding parts formed on portions of an upper portion of the circuit pattern; second bonding parts formed on portions of the upper portion of the circuit pattern; a first semiconductor device mounted on the board; a first connecting member of electrically connecting the first bonding part and the first semiconductor device to each other; a second connecting member having one surface bonded to the second bonding part and the other end exposed to the outside; and an oxide film formed on the remaining portions except for the first bonding part and the second bonding part. |
| 申请公布号 |
US2015187726(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414582196 |
申请日期 |
2014.12.24 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Sung Keun;Myung Jun Woo;Song Sung Min |
| 分类号 |
H01L23/00;H01L23/495 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a board on which an insulating layer and a plurality of circuit patterns are formed; first bonding parts formed on portions of an upper portion of the circuit pattern; second bonding parts formed on portions of the upper portion of the circuit pattern; a first semiconductor device mounted on the board; a first connecting member of electrically connecting the first bonding part and the first semiconductor device to each other; a second connecting member having one surface bonded to the second bonding part and the other end exposed to the outside; and an oxide film formed on the remaining portions except for the first bonding part and the second bonding part. |
| 地址 |
Suwon-Si KR |
