SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor package includes a dielectric layer in which a chip is embedded, interconnection parts disposed on a first surface of the dielectric layer, through connectors each of which penetrates a portion of the dielectric layer over the chip to electrically couple the chip to a corresponding one of the interconnection parts, a shielding plate covering a second surface of the dielectric layer that is opposite to the first surface, and a shielding encapsulation part connected to one of the interconnection parts and covering sidewalls of the dielectric layer. The shielding encapsulation part includes a portion contacting the shielding plate.

主权项

1. A semiconductor package, comprising:
a chip embedded in a dielectric layer; interconnection parts disposed on a first surface of the dielectric layer; through connectors each of which penetrates a portion of the dielectric layer over the chip, each of the through connectors electrically coupling the chip to one of the interconnection parts; a shielding plate covering a second surface of the dielectric layer that is opposite to the first surface; and a shielding encapsulation part connected to one of the interconnection parts, covering sidewalls of the dielectric layer, and including a portion that contacts the shielding plate.