发明名称 |
Lid for Integrated Circuit Package |
摘要 |
A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a copper substrate and a native silicon oxide layer connected to the substrate by at least one intermediate layer. A method of providing a heat path through an integrated circuit package includes providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material. |
申请公布号 |
US2015187677(A1) |
申请公布日期 |
2015.07.02 |
申请号 |
US201514644412 |
申请日期 |
2015.03.11 |
申请人 |
Texas Instruments Incorporated |
发明人 |
Shirley Dwayne Richard |
分类号 |
H01L23/373;B32B37/12;B32B37/18;H01L23/06 |
主分类号 |
H01L23/373 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Dallas TX US |