| 发明名称 |
CURABLE COMPOSITIONS AND THERMOSETS PREPARED THEREFROM |
| 摘要 |
A curable composition comprising (a) at least one low viscosity epoxide resin compound having the following chemical structure: (I) wherein R1 and R2 are hydrogen or a hydrocarbon group having from 1 to 20 carbon atoms, with the proviso that R1 and R2 are not both hydrogen, and (b) at least one curing agent or UV photoinitiator; and a thermoset prepared from the above curable composition.; |
| 申请公布号 |
US2015183923(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201314423864 |
申请日期 |
2013.10.25 |
| 申请人 |
Dow Global Technologies LLC |
发明人 |
Potisek Stephanie L.;Mullins Michael J. |
| 分类号 |
C08G59/02;C09J163/00;C09D163/00 |
主分类号 |
C08G59/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A curable composition comprising at least one low viscosity epoxide resin compound comprising an epoxide compound having the following chemical structure: wherein R1 and R2 comprises hydrogen or a hydrocarbon group having from C1 to about C20 carbon atoms; with the proviso that R1 and R2 are not both hydrogen. |
| 地址 |
Midland MI US |
