| 摘要 |
A circuit board (10) is placed inside a mold (100) and an outer case (20) is injection-molded as follows: while using a pressure-applying member (110) to press at least part of the top-surface side of an unmolded section (10A) facing a non-cavity space against a bottom-surface side, the cavity of the mold is filled with a molten resin. |
