摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC socket that is prevented from positionally displaced while storing an IC package therein and prevents a floating plate from warping while storing the IC package.SOLUTION: An IC socket 12, when storing an IC package 11 therein, stores the IC package 11 on a floating plate 15 and then presses the package from above. This causes the floating plate 15 to be moved down against a load generated in a load generating mechanism 16. The IC package is pressed by sufficient contact pressure against the floating plate 15 to be moved down so that the IC package 11 can be prevented from being positionally displaced when moved down. The load generating mechanism 16 does not generate a load when the floating plate 15 reaches the lowest position. This prevents the floating plate 15 from warping while storing the IC package although the IC package is contacted with the floating plate 15.</p> |