发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 A light emitting device includes a substrate, a light emitting element mounted on the substrate, a light transmissive member placed on an upper surface of the light emitting element, and a sealing member which seals the light emitting element and the light transmissive member. The light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above. The sealing member includes a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element, and a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having wavelength different from wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member.
申请公布号 US2015188004(A1) 申请公布日期 2015.07.02
申请号 US201414582323 申请日期 2014.12.24
申请人 NICHIA CORPORATION 发明人 OZEKI Kenji;MIYOSHI Tomonori
分类号 H01L33/50;H01L33/48;H01L33/60;H01L33/54 主分类号 H01L33/50
代理机构 代理人
主权项 1. A light emitting device, comprising: a substrate; a light emitting element mounted on the substrate; a light transmissive member disposed on an upper surface of the light emitting element wherein the light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above; and a sealing member which seals the light emitting element and the light transmissive member, wherein the sealing member includes: a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element; anda second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having a wavelength different from a wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member.
地址 Anan-shi JP