发明名称 ELECTRONIC-CIRCUIT UNIT AND MANUFACTURING METHOD THEREFOR
摘要 This invention is an electronic-circuit unit (1) in which part of a circuit board (10) covered by an outer case (20) made from a molded resin constitutes a mold exclusion section (10A), the bottom surface of which is covered by the molded resin and the top surface of which is exposed by the outer case. The outer case is obtained via multicolor molding using a plurality of resins exhibiting different degrees of fluidity, wherein a bottom wall (20B) of said outer case, said bottom wall being located on the bottom-surface side of the mold exclusion section, is made from a resin that exhibits a higher degree of fluidity than a resin or resins constituting the rest of the outer case.
申请公布号 WO2015098569(A1) 申请公布日期 2015.07.02
申请号 WO2014JP82939 申请日期 2014.12.12
申请人 YAZAKI CORPORATION 发明人 ITO KEN
分类号 H02G3/16 主分类号 H02G3/16
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