<p>The present invention relates to a heating apparatus for bonding a panel and a pad. The heating apparatus comprises: a base unit; a support unit installed in the base unit and supporting a panel; and a heating unit installed in the support unit and controlling the temperature of the panel. Height of the support unit is controlled to be heated universally using various panels.</p>
申请公布号
KR101532950(B1)
申请公布日期
2015.07.02
申请号
KR20140041727
申请日期
2014.04.08
申请人
ILJI TECHNOLOGY CO., LTD.
发明人
KOO, JUN MO;PARK, JIN WON;SON, SOON KEUN;SHIN, CHANG YEUL;OH, BO RA MI