| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve versatility.SOLUTION: A component mounting device includes: a plurality of adsorption heads 42 including adsorption parts 48 for adsorbing a plurality of electronic components 300 mounted on a substrate 100 in equal interval pitches via a solder 301 beforehand and heaters 51 for heating at least the solder, and bonding the plurality of electronic components adsorbed by the adsorption parts at predetermined positions on the substrate, via the solder; a plurality of drivers 41 for vertically moving the plurality of adsorption heads, respectively; and a drive link mechanism 53 which is connected to the plurality of drivers, varies the plurality of drivers and the plurality of adsorption heads in equal interval pitches and integrally moves the plurality of drivers and the plurality of adsorption heads in a pitch variable direction while maintaining the equal interval pitches.</p> |
