发明名称 MOLECULAR LAYER DEPOSITION USING REDUCTION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a molecular layer deposition (MLD) on a substrate using a radical.SOLUTION: In a method of depositing a material on a substrate 120, the method includes: a step of depositing the material on the substrate 120 by exposing the substrate 120 to a metal-containing precursor and allowing the substrate 120 to absorb a metallic atom of the metal-containing precursor; a step of depositing a material layer by exposing the substrate 120 into which the metal-containing precursor is implanted to an organic precursor and allowing the organic precursor to react with the metallic atom absorbed into the substrate 120; and a step of increasing reactivity of the material deposited on the substrate 120 by exposing the substrate 120 to a radical of a reducing agent.
申请公布号 JP2015120977(A) 申请公布日期 2015.07.02
申请号 JP20140237773 申请日期 2014.11.25
申请人 VEECO ALD INC 发明人 LEE SANG IN;HWANG CHANG WAN
分类号 C23C16/455 主分类号 C23C16/455
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