| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can inhibit the occurrence of warpage.SOLUTION: A wiring board 10 has a wiring structure 11 which includes: a core substrate 20; an insulation layer 41 which is laminated on a top face 20A of the core substrate 20 and composed of an insulating resin with a reinforcement material; an insulation layer 31 which is laminated on an undersurface 20B of the core substrate 20 and composed of an insulating resin with a reinforcement material; and via wiring 42 formed in the insulation layer 41. The wiring board 10 has: insulation layers 51, 53 and wiring layers 50, 52, 54, which consist chiefly of a photosensitive resin; a wiring structure 12 laminated on a top face 41A of the insulation layer 41; and a solder resist layer 13 which is laminated on an undersurface of the insulation layer 31 and consist chiefly of a photosensitive resin. A wiring density of the wiring structure 12 is higher than a wiring density of the wiring structure 11. The wiring board further includes glass cloths 41G which are provided in the insulation layer 41 and unevenly distributed on an upper side than the center of the insulation layer 41 in a thickness direction. |
