Semiconductor Device On Cover Substrate And Method Of Making Same

摘要

A sensor device comprising a sensor die, a second substrate and a conductor assembly. The sensor die includes a first substrate having front and back surfaces, a sensor disposed in or at the front surface, bond pads disposed in or at the front surface and electrically coupled to the sensor, and a plurality of openings each extending from the back surface to one of the bond pads. The second substrate has top and bottom surfaces, wherein the bottom surface of the second substrate is mounted to the front surface of the first substrate. The conductor assembly is electrically coupled to at least some of the bond pads through at least some of the openings.

主权项

1. A sensor device comprising:
a sensor die comprising:
a first substrate having front and back surfaces,a sensor disposed in or at the front surface,bond pads disposed in or at the front surface and electrically coupled to the sensor, anda plurality of openings each extending from the back surface to one of the bond pads; a second substrate having top and bottom surfaces, wherein the bottom surface of the second substrate is mounted to the front surface of the first substrate; and a conductor assembly electrically coupled to at least some of the bond pads through at least some of the openings.