| 发明名称 |
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF |
| 摘要 |
A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture. |
| 申请公布号 |
US2015187722(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414255326 |
申请日期 |
2014.04.17 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chiang Cheng-Chia;Jiang Don-Son;Wang Lung-Yuan;Tung Shih-Hao;Huang Shu-Huei |
| 分类号 |
H01L23/00;H01L23/31;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts. |
| 地址 |
Taichung TW |
