| 发明名称 |
MAGNET PLACEMENT FOR INTEGRATED SENSOR PACKAGES |
| 摘要 |
Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate. |
| 申请公布号 |
US2015185247(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201314141759 |
申请日期 |
2013.12.27 |
| 申请人 |
Eid Feras;OSTER Sasha N.;LEE Kyu Oh;HANEY Sarah |
发明人 |
Eid Feras;OSTER Sasha N.;LEE Kyu Oh;HANEY Sarah |
| 分类号 |
G01P15/11;G01P1/04 |
主分类号 |
G01P15/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
applying a terminal to a magnet; placing the magnet on a top layer of a substrate with solder between the terminal and the top layer; and reflowing the solder to attach the magnet to the substrate. |
| 地址 |
Chandler AZ US |
