| 发明名称 |
Label Application System |
| 摘要 |
According to an aspect, the present invention is directed to a method for applying a label to a substrate. The method includes applying an ink layer to a transfer mechanism; applying a binding layer to the ink layer; and contacting the binding layer to the substrate such that the binding layer and the ink layer are substantially removed from the transfer mechanism. |
| 申请公布号 |
US2015183544(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414570278 |
申请日期 |
2014.12.15 |
| 申请人 |
Avery Dennison Corporation |
发明人 |
MOFFATT John;WYATT Mark J.;SEN Radha;ZHANG Yuan Yuan |
| 分类号 |
B65C3/08;B65C9/22;B65C9/26;B65C9/00 |
主分类号 |
B65C3/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for applying a label to a substrate, the method comprising:
a. applying an ink layer to a transfer mechanism; b. applying a binding layer to the ink layer; and c. contacting the binding layer to the substrate such that the binding layer and the ink layer are substantially removed from the transfer mechanism. |
| 地址 |
Glendale CA US |
