发明名称 |
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE |
摘要 |
Provided is a method for producing a semiconductor package with which it is possible to prevent the surrounding area of a section to be exposed to light of a buffer coat film from being exposed to light. The present invention relates to a method for producing a semiconductor package, wherein the surface roughness of a surface, of a cured body, on which a film is to be formed is less than or equal to a predetermined value. |
申请公布号 |
WO2015098835(A1) |
申请公布日期 |
2015.07.02 |
申请号 |
WO2014JP83906 |
申请日期 |
2014.12.22 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MORITA, KOSUKE;ISHIZAKA, TSUYOSHI;ISHII, JUN;SHIGA, GOJI;IINO, CHIE |
分类号 |
H01L23/12;G03F7/38;H01L21/56 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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