ELECTRONIC COMPONENT LOADING SUBSTRATE AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component loading substrate having high heat dissipation efficiency.SOLUTION: The electronic component loading substrate includes: an insulating substrate having an electronic component loading part on its upper surface; an electrode layer formed in the insulating substrate and inclined from the upper surface; a first via formed from the inside of the insulating substrate to the upper surface, connected to the electrode layer at its lower end and formed so as to be overlapped to the electronic component loading part in top view; and a second via formed from the inside of the insulating substrate to a lower surface of the insulating substrate, connected to the electrode layer at its upper end and formed on a position separated from the first via in top view.