发明名称 |
MANUFACTURING APPARATUS OF SIC EPITAXIAL WAFER AND MANUFACTURING METHOD OF SIC EPITAXIAL WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a silicon carbide (SiC) epitaxial wafer which equalizes the carrier concentration on a wafer surface with a simple structure and achieves excellent manufacturing quality and productivity, and to provide the SiC epitaxial wafer which is manufactured by the apparatus.SOLUTION: A manufacturing apparatus of a silicon carbide (SiC) epitaxial wafer of the invention includes: a loading plate 2 having a recessed storage part; a satellite 3 where a SiC substrate is placed on an upper surface, the satellite 3 being disposed in the recessed storage part 23; and a carbon member disposed at a position in the recessed storage part 23 that is located below the SiC substrate and does not contact with the SiC substrate. |
申请公布号 |
JP2015122443(A) |
申请公布日期 |
2015.07.02 |
申请号 |
JP20130266010 |
申请日期 |
2013.12.24 |
申请人 |
SHOWA DENKO KK |
发明人 |
NORIMATSU JUN;MIYASAKA AKIRA;KAGESHIMA YOSHIAKI |
分类号 |
H01L21/205;C23C16/42;C23C16/458;H01L21/683 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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