发明名称 MANUFACTURING APPARATUS OF SIC EPITAXIAL WAFER AND MANUFACTURING METHOD OF SIC EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a silicon carbide (SiC) epitaxial wafer which equalizes the carrier concentration on a wafer surface with a simple structure and achieves excellent manufacturing quality and productivity, and to provide the SiC epitaxial wafer which is manufactured by the apparatus.SOLUTION: A manufacturing apparatus of a silicon carbide (SiC) epitaxial wafer of the invention includes: a loading plate 2 having a recessed storage part; a satellite 3 where a SiC substrate is placed on an upper surface, the satellite 3 being disposed in the recessed storage part 23; and a carbon member disposed at a position in the recessed storage part 23 that is located below the SiC substrate and does not contact with the SiC substrate.
申请公布号 JP2015122443(A) 申请公布日期 2015.07.02
申请号 JP20130266010 申请日期 2013.12.24
申请人 SHOWA DENKO KK 发明人 NORIMATSU JUN;MIYASAKA AKIRA;KAGESHIMA YOSHIAKI
分类号 H01L21/205;C23C16/42;C23C16/458;H01L21/683 主分类号 H01L21/205
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