发明名称 TEMPERATURE ADJUSTMENT DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To improve pressure-feed efficiency of a heat medium liquid to a supply object, to save a space, and to sufficiently reduce manufacturing costs.SOLUTION: A temperature adjustment device includes a pump-side pipe connecting portion 21 which is provided with a cooling water inlet H1 for introducing cooling water pressure-fed by a pump and to which a pump-side pipe P1b is connected, and a supply object-side pipe connecting portion 22 which is provided with a cooling water outlet H2 for discharging the cooling water introduced from the cooling water inlet H1 and to which a supply object-side pipe P1c is connected. A pressure sensor 6 and a temperature sensor 7 are mounted on a pipe P1 by a sensor mounting tool Px on which a pressure sensor mounting portion 23 provided with a pressure sensor insertion hole H3 to which the pressure sensor 6 can be inserted to mount the pressure sensor 6, and a temperature sensor mounting portion 24 provided with a temperature sensor insertion hole H4 to which the temperature sensor 7 can be inserted to mount the temperature sensor 7, are integrally formed with the pump-side pipe connecting portion 21 and the supply object-side pipe connecting portion 22.</p>
申请公布号 JP2015121377(A) 申请公布日期 2015.07.02
申请号 JP20130266239 申请日期 2013.12.25
申请人 ORION MACH CO LTD 发明人 SUGIMOTO SEITARO;NAKAJIMA TAKAHISA;MATSUMOTO YUKI;HOTANI TOSHIYUKI
分类号 F25B49/02;F25B1/00 主分类号 F25B49/02
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