ELECTROSTATIC CHUCK WITH EXTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION

摘要

An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

主权项

1. An apparatus comprising:
a dielectric puck to electrostatically grip a silicon wafer; a cooling plate fastened to and thermally coupled to the dielectric puck; a supply plenum to receive coolant from an external source; a plurality of coolant chambers thermally coupled to the cooling plate, the coolant chambers to receive coolant from the supply plenum; a return plenum coupled to the cooling chambers to exhaust coolant from the cooling zones; and a plurality of flow control valves between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.