| 发明名称 |
APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES |
| 摘要 |
An apparatus for processing wafer-shaped articles, comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, and comprises a lower surface facing inwardly of the chamber. At least one heating element heats the lower surface of the lid to a desired temperature, so as to prevent condensation of process vapour on the inwardly facing surface of the lid. |
| 申请公布号 |
US2015187612(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201314145634 |
申请日期 |
2013.12.31 |
| 申请人 |
LAM RESEARCH AG |
发明人 |
OBWEGER Rainer |
| 分类号 |
H01L21/67;H01L21/687 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Apparatus for processing wafer-shaped articles, comprising a closed process chamber, said closed process chamber comprising a housing providing a gas-tight enclosure, a rotary chuck located within said closed process chamber, said rotary chuck being adapted to hold a wafer shaped article thereon, and a lid secured to an upper part of said closed process chamber, said lid comprising a lower surface facing inwardly of said chamber and at least one heating element for heating said lower surface to a desired temperature. |
| 地址 |
Villach AT |
