| 发明名称 |
METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES |
| 摘要 |
In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A first liquid dispenser communicates with a supply of an organic liquid and is positioned so as to dispense the organic liquid onto a surface of a wafer-shaped article. A degasifying unit is positioned upstream of the first liquid dispenser and downstream of the supply. The degasifying unit is configured to reduce a dissolved gas content of the organic liquid to less than 20% of a saturation concentration at a pressure of 1 bar. |
| 申请公布号 |
US2015187561(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201314145727 |
申请日期 |
2013.12.31 |
| 申请人 |
LAM RESEARCH AG |
发明人 |
FRANK Dieter;DALMER Michael |
| 分类号 |
H01L21/02;B01D53/22;B01D19/00;H01L21/67 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Apparatus for treating a wafer-shaped article, comprising:
a spin chuck for holding and rotating a wafer-shaped article; a first liquid dispenser communicating with a supply of an organic liquid and positioned so as to dispense the organic liquid onto a surface of a wafer-shaped article when positioned on the spin chuck; and a degasifying unit positioned upstream of said first liquid dispenser and downstream of said supply, said degasifying unit being configured to reduce a dissolved gas content of the organic liquid to less than 20% of a saturation concentration at a pressure of 1 bar. |
| 地址 |
Villach AT |
