发明名称 FILM FORMATION METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESS
摘要 A film formation method performs a supply cycle of sequentially supplying two kinds of reactive gases inside a vacuum container to form a thin film on the substrate. The method includes placing the substrate, including a depressed portion formed thereon, on a table, then adjusting a temperature of the substrate to a temperature at which a first reactive gas is adsorbed and condensed, then supplying the first reactive gas and thereby depositing a condensed substance of the first reactive gas on the substrate, then rotating the table, then partly vaporizing the condensed substance by supplying a heated gas to the substrate; and then supplying a second reactive gas in an activated state to the substrate and thereby causing the second reactive gas to react with the condensed substance.
申请公布号 US2015184293(A1) 申请公布日期 2015.07.02
申请号 US201514644703 申请日期 2015.03.11
申请人 TOKYO ELECTRON LIMITED 发明人 KATO Hitoshi;ORITO Kohichi
分类号 C23C16/455;H01L21/762;H01L21/02;C23C16/48;C23C16/40 主分类号 C23C16/455
代理机构 代理人
主权项 1. (canceled)
地址 Tokyo JP