THERMOSETTING RESIN COMPOSITION AND USAGE THEREOF

摘要

The present invention relates to a thermosetting resin composition, wherein the resin composition comprises: (A) an epoxy resin with main chain containing naphthol structure; (B) a cyanate ester compound or/and an isocyanate ester prepolymer; (C) a poly phosphonate ester or/and phosphonate-carbonate copolymer. The thermosetting resin provided by the present invention has low dielectric constant and dielectric loss angular tangent value. The prepreg and copper-clad laminate made from the thermosetting resin composition above has excellent dielectrical properties, wet-heat resistance, flame resistance of UL94 V-0 grade and good technical processing performance.

主权项

1. A thermosetting resin composition comprising of:
(A) epoxy resin with main chain containing naphthol structure; (B) cyanate ester compounds or/and cyanate prepolymer; (C) polyphosphonate ester or/and phosphonate-carbonate copolymer.