| 发明名称 |
RESIN COMPOSITION AND USES OF THE SAME |
| 摘要 |
A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component. |
| 申请公布号 |
US2015183952(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414582233 |
申请日期 |
2014.12.24 |
| 申请人 |
TAIWAN UNION TECHNOLOGY CORPORATION |
发明人 |
Liu Shur-Fen;Chen Meng-Huei;Wu Hsin-Ho |
| 分类号 |
C08K3/22;C08L63/00;B05D1/18;C08L71/02;C08K5/02;C08J5/24;B32B15/14;C08L37/00 |
主分类号 |
C08K3/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition, comprising:
a thermosetting resin component, having a dissipation factor (Df) of no more than 0.006 at 1 GHz; and a filler, which is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., wherein, the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component. |
| 地址 |
Chupei City TW |
