| 摘要 |
The present invention relates to a modular cooling apparatus for a high-voltage direct-current transmission system. A sub-module (10) according to the present invention comprises a power unit (12) in the front and a capacitor unit (13) in the rear, and a heat sink (30) for discharging heat generated from the interior is provided in an interior space (14') of a power unit housing (14) forming the exterior of the power unit (12). A coolant path (31) is provided in the interior of the heat sink (30). The entrance and exit of the coolant path (31) are located adjacent to the bottom surface of the interior space (14'). Connecting couplers (20) for supplying coolant to the interior space (14') are provided on the sloped surface (16) on the bottom end of the front surface (15) of the power unit housing (14). The sloped surface (16) is formed so as to face the ground at an angle. On both side surfaces of the power unit housing (14) are pass-through parts (22), each of which is provided with a louver plate (24) having louvers (26) to allow air to circulate between the interior space (14') and the outside. As such, according to the present invention, heat is dissipated more effectively while damage to the sub-module (10) due to coolant leakage does not occur. |
