| 摘要 |
<p>The present invention relates to a photosensitive resin composition for a dry film photoresist and, more particularly, provides a photosensitive resin composition for a dry film photoresist, which can not only improve tent reliability regarding a developer, but also is suitable for a laser direct exposure device, which is capable of exposure even with a small amount of exposure energy, such that productivity can be maximized in the case of a facility in which the rate of the exposure process governs the overall production rate, or in connection with generating images on PCBs, lead frames, PDPs, and other display devices.</p> |
