| 发明名称 |
METHOD OF MANUFACTURING ELECTRIC WIRING LAYER, MEMBER FOR FORMING ELECTRIC WIRING LAYER, ELECTRIC WIRING LAYER, METHOD OF MANUFACTURING ELECTRIC WIRING BOARD, MEMBER FOR FORMING ELECTRIC WIRING BOARD, ELECTRIC WIRING BOARD, VIBRATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT |
| 摘要 |
A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region. |
| 申请公布号 |
US2015188024(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414578991 |
申请日期 |
2014.12.22 |
| 申请人 |
Seiko Epson Corporation |
发明人 |
ISHIGAMI Hideki;NAKAMURA Hidefumi;SHIOHARA Yukihiko;KAWASAKI Taku;AKAHANE Fumiaki |
| 分类号 |
H01L41/047;H01L41/053;B22F3/105;H01L41/29;B22F5/12;H05K1/03;H01L41/333 |
主分类号 |
H01L41/047 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing an electric wiring layer including an electric wiring, the method comprising:
obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region. |
| 地址 |
Tokyo JP |
