发明名称 DYNAMIC THERMAL BUDGET ALLOCATION FOR MULTI-PROCESSOR SYSTEMS
摘要 Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each processor from a total processor thermal budget based on the workload of each processor. In this manner, the processor(s) having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. The individual and overall processor performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.
申请公布号 US2015185814(A1) 申请公布日期 2015.07.02
申请号 US201414292785 申请日期 2014.05.30
申请人 Samsung Electronics Co., Ltd. 发明人 PING Zhan;BRENNAN Robert;MARTINEAU Jason
分类号 G06F1/32;G06F1/26 主分类号 G06F1/32
代理机构 代理人
主权项 1. A method for dynamically allocating a thermal budget for a multi-processor system, the method comprising: detecting a first amount of current or power being consumed by a first processor; detecting a second amount of current or power being consumed by a second processor; determining, by dynamic thermal budget logic, power ratios associated with the first amount of current or power being consumed by the first processor and the second amount of current or power being consumed by the second processor; determining credits ratios based at least in part on the power ratios; allocating first thermal budget credits to the first processor in accordance with the credits ratios; and allocating second thermal budget credits to the second processor in accordance with the credits ratios, wherein the credits ratios are proportional to the power ratios.
地址 Suwon-si KR