| 摘要 |
<p>By performing insert molding with a positioning pin in a mold inserted into a through-hole (15) in a circuit board (10), connecting holes (35) that connect said through-hole (15) to the outside are formed on both sides of a case (30), and metal plating (45) for testing the circuit board (10) is applied to the inside walls of the through-hole (15) and the connecting holes (35).</p> |
