PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD EQUIPPED WITH ELECTRIC-COMPONENT CONNECTION UNIT, AND ELECTRIC CIRCUIT DEVICE HAVING PRINTED CIRCUIT BOARD OBTAINED BY SAID PRODUCTION METHOD EMBEDDED THEREIN

摘要

The present invention relates to: a novel production method for a printed circuit board equipped with an electric-component connection unit, by which the electric-component connection unit can be automatically mounted to the printed circuit board by reflow soldering and without the need for conveying tools, even when the electric-component connection unit is arranged along substantially the entire length of a width direction edge of the printed circuit board; and an electric circuit device having the printed circuit board obtained by said novel production method embedded therein. Included are: a printed circuit board preparation step in which a printed circuit board (12) to which a pair of disposable substrates (80)(80), which are supported by a conveying rail (90), are removably linked is prepared; a reflow step in which, in a state such that the electric-component connection unit (18) is loaded on a mounting unit (16), the pair of disposable substrates (80) (80) are supported by the conveying rail (90) and the printed circuit board (12) is conveyed into a reflow furnace; and a removal step in which, subsequent to the reflow step, a disposable substrate (80) is removed.