| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrode plate for a plasma processing apparatus which prevents the reverse flow of plasma to prevent the damage of a cooling plate and enables plasma processing to be uniformly performed on a surface of a processed substrate. <P>SOLUTION: An electrode plate 3 is provided with multiple vent holes 11 penetrating through the electrode plate 3 in the thickness direction. Each vent hole 11 is formed by creating communication between a first hole part 21 having a large diameter and a second hole part 22 having a smaller diameter than the first hole part 21. The first hole parts 21 open on a radiation surface 3a on the processed substrate side. The lengths B of the second hole parts 22 of the vent holes 11 disposed at a center part of the electrode plate 3 are set so as to be shorter than the lengths of the second hole parts 22 of the vent holes 11 disposed at an outer peripheral part of the electrode plate 3. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
