| 摘要 |
A semiconductor package includes a substrate, a first ground wire which includes a first inner ground wire which is arranged around the substrate and a first extension ground wire which is extended to the side of the substrate from the first inner ground wire and has an end which is exposed on the side of the substrate, a chip which is located on the substrate, a molding layer which covers the chip, and an electromagnetic interference shield layer which covers the side of the substrate and the molding layer and is arranged in contact with the end of the first extension ground wire. |
