SEMICONDUCTOR PACKAGE DECREASABLE SIZE

摘要

The present invention relates to a semiconductor package capable of reducing a size thereof. The semiconductor package includes a semiconductor device which is supported on a frame, a lead frame which is connected to the semiconductor device by a bonding wire, and a passivation part which completely surrounds the frame, the semiconductor device and the bonding wire, and surrounds a part of the lead frame. Manufactured is the semiconductor package with a small size in comparison with an existing semiconductor package with a horizontal arrangement, capable of sufficiently securing an insulation distance between the adjacent lead frames by arranging the adjacent lead frames with different heights on the lateral view of the passivation part.