半导体封装件及其制法;SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

一种半导体封装件及其制法，该制法包括：于一其上形成有第一黏着层的第一承载板上接置具有作用面之晶片，且该作用面系接置该第一黏着层；于该第一黏着层上形成包覆该晶片的封装胶体，令该封装胶体具有接触该第一黏着层的第一表面与其相对之第二表面；形成外露该第一黏着层的封装胶体开孔；于该封装胶体开孔中的第一黏着层上形成电性连接垫；于该电性连接垫上接置第一导电元件；藉由第二黏着层于该封装胶体之第二表面上接置第二承载板；移除该第一承载板与第一黏着层；于该封装胶体之第一表面上形成电性连接该作用面与电性连接垫的线路重布层；以及移除该第二承载板与第二黏着层。本发明能增进产品良率与可靠度。; forming a package colloid for coating the wafer on the first adhesive layer, the package colloid has a first surface in contact with the first adhesive layer, and has an opposite second surface; forming a package colloid opening for exposing the first adhesive layer; forming an electrical connection pad on the first adhesive layer in the package colloid opening; setting a first conductive element in contact with the electrical connection pad; setting a second carrier plate in contact with a second surface of the package colloid via a second adhesive layer; removing the first carrier plate and the first adhesive layer; forming a wiring redistribution layer for electrically connecting the active surface and the electrical connection pad on the first surface of the package colloid; and removing the second carrier plate and the second adhesive layer. This invention can enhance product yield and reliability.