| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a MEMS (Micro Electro Mechanical Systems) device reducing thickness of the whole package when packaging a MEMS element and relaxing influence of stress generated by warping due to a difference in thermal expansion coefficients between a substrate and an IC to affect the MEMS element, and a method for manufacturing the MEMS device. <P>SOLUTION: This MEMS device includes: a wiring substrate with an opening; a control element arranged in the opening of the wiring substrate; and at least a MEMS element arranged on one surface of the control element. The control element has the exposed other surface and is fixed to the wiring substrate via resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
