发明名称 |
低磁性化学机械研磨修整器;LOW MAGNETIC CHEMICAL MECHANICAL POLISHING CONDITIONER |
摘要 |
本发明系有关于一种低磁性化学机械研磨修整器,包括:一基板;一结合层,该结合层系设置于该基板上;以及复数个研磨颗粒,该些研磨颗粒系埋设于该结合层,且该些研磨颗粒藉由该结合层以固定于该基板上;其中,该些研磨颗粒系透过一磁选装置进行筛选,使该些研磨颗粒为一非磁性含量或一低磁性含量。因此,用于本发明之低磁性化学机械研磨修整器之研磨颗粒较佳为非磁性研磨颗粒,以避免因磁性研磨颗粒而影响研磨性能。; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein the abrasive particles are screened into a non-magnetic content and a low magnetic content through a magnetic separation device. Therefore, the abrasive particles used in the low magnetic chemical mechanical polishing conditioner of the present invention are non-magnetic abrasive particles perfectly to avoid influence of polishing performance due to magnetic abrasive particles. |
申请公布号 |
TW201524684 |
申请公布日期 |
2015.07.01 |
申请号 |
TW102147394 |
申请日期 |
2013.12.20 |
申请人 |
中国砂轮企业股份有限公司 KINIK COMPANY |
发明人 |
吴天宇 WU, TIAN YEU |
分类号 |
B24B53/017(2012.01);B03C1/00(2006.01) |
主分类号 |
B24B53/017(2012.01) |
代理机构 |
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代理人 |
苏建太林志鸿苏清泽 |
主权项 |
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地址 |
台北市中正区延平南路10号 TW |