刚性可挠性印刷电路板及其制造方法;RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

一种刚性可挠性印刷电路板及其制造方法。刚性可挠性印刷电路板包括：具有一可挠性区域以及多个刚性区域的一可挠性基板；形成于刚性区域内且自刚性区域延伸以覆盖可挠性区域之一部分的第一绝缘层；以及形成于刚性区域之第一绝缘层内的多个增层(build-up layer)，且增层包括一增层式绝缘层以及一电路图案，其中多个增层中的至少一者之一厚度系不同于其他增层的厚度。; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers.