CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip electronic component which includes a magnetic body having a coil conductive pattern part buried; and an oxidative film formed on a surface of the coil conductive pattern part, and to a manufacturing method thereof. According to the chip electronic component and the manufacturing method thereof of an embodiment of the present invention, an insulation film which is thinner than an existing insulation film is formed, while preventing exposure of the coil conductive pattern part, so that the magnetic material and the coil conductive pattern part do not directly contact, thereby preventing wave form defect in high frequency.